• Production Level In-Line Measurement

• Stand-alone wafer edge inspection

• Integrated with cassette wafer loading

• Profiling the wafer edge

• Detection of broken and chipped wafer edges

• Detection of micro cracks on the wafer edge

• Detection of upper wafer edge defects or lower wafer edge defects

• Application for opaque and transparent wafers

• Classification according to SEMI Standards

• Graphical output of visual inspection results

• Log of wafer edge defects

• MES data export