• Optical inspection for marco defects and micro defects

• Visual information of defects and their mapping

• Systems with manual wafer handling and automatic mapping function

• Bare and pattern samples

• Wafer on dicing tapes

• Dies in Waffle packs

• Semi-automatic defect inspection system

• Defect inspection for:
    Substrate wafer / EPI wafer / patterned wafer / Diced wafer / Dies and Individual samples

• Create different receipt with rapid scanning, mosaicking user-specific way for presenting results, defect classification

• Save image data for records or additional image processing with different parameter settings

• Result data communication with different communication formats, e.g. KLARF

• High resolution microscope with object lenses from 2,5x to 50x

• LED lightning for BF;DF and DIC, transmitted light option

• Motorized X/Y-Stage with 0.04µm increment

• Wafer chuck for 2”,3”, 100mm, 150mm and 20mm or other sample holder available

• Automatic defect inspection

• Defect inspection for: Substrate wafer / EPI wafer / patterned wafer / Diced wafer / Dies Individual samples

• Create different receipt with rapid scanning, mosaicking user-specific way for presenting results, defect classification

• Save data as e.g. KLARF or CSV

• High resolution microscope with objective from 2,5x to 50x

• LED lightning for BF;DF and DIC, transmitted light option

• Motorized X/Y-Stage with 0.04µm increment

• Wafer chuck for 2”,3”, 100mm, 150mm and 20mm or other sample holder

• Wafer loader with pre-aligner

• Carrier and wafer size detection

• OCR reader option

• GEM/SECS Option