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M-RES
2000
The M-RES 2000 is the ideal non-contact resistivity
measurement system for all applications in the semiconductor
production of silicon or compound material applications. The
M-RES 2000 resistivity measurement systems are typically supplied
with two sensor systems for a measurement range over 6 decades.
The measurement range is preset at the factory for the corresponding
application for measuring resistivities between 50 µOhm/sq
and over 100 kOhm/sq. The M-RES 2000 non-contact resistivity
measurement system is available for measuring resistivities
up to 500 kOhm/sq. Various models of the measurement systems
are available either for manual operation, semi-automated operation
with mapping function or as a fully automated measurement system
with integrated wafer handling. The M-RES 2000 is capable of
measuring wafers with 2" to 300mm diameters.
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In addition, the non-contact
resistivity measurement systems of the M-RES 2000 model
series offer a non-contact measurement of the wafer thickness.
This measurement is performed together with the resistivity
measurement, almost at the same site. It is used, for
example, to calculate measurement values directly for
the bulk resistivity of the sample. In addition, the wafer
thickness data is used to perform the automatic correction
of the measurement results in relation to the wafer thickness.
The measurement systems of the M-RES 2000 model series
can therefore be used for measuring wafers of varying
thickness without requiring special calibration for each
wafer thickness. As a further automatic correction of
the measurement values, a temperature measurement is integrated,
recording the sample temperature during the measurement.
Finally, the non-contact determination of the conductivity
type that is also available completes the automatic correction
of the non-contact resistivity measurement with the measurement
systems of the M-RES 2000 model series.
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